| bonding |
The process by which one type of substrate is attached to the surface of another. [6]
출처: butler.cc.tut.fi/~kuncova/MIFLUS/microfluidics_ter...
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|---|---|
| bonding |
A technique used to combine B channels for higher transfer rates. Unlike PPP/MP, bonding is controlled in hardware, and bandwidth cannot not be allocated dynamically once a connection has been established. See also Inverse Multiplexing.
출처: www.infopage.net/myspace/internet/isdn-j/isdnjargo...
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| bond |
A certificate of debt issued to raise funds. Bonds typically pay a fixed rate of interest and are repayable at a fixed date.
출처: www.misys.com/investors/shareservices/glossary/ind...
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| bond |
A debt security greater than one year wherein an issuer contracts to pay the owner a fixed principal amount on a stated future date. Typically, there are also interest payments over the life of the bond.
출처: www.ofina.on.ca/debt/glossary.html
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| bond |
A debt instrument that is a "promise to pay" issued by corporations, federal and state goverments, and municipalities to raise capital. The bond issuer promises to pay the holder of the bond the principal amount of the loan when the bond matures and a fixed rate of interest periodically during the term of the bond.
출처: www.northernfunds.com/resources/glossary/b.html
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